The manufacturing base, government support, and investments in semiconductor technologies in Asia Pacific are some of the major market drivers. China's Semiconductor Manufacturing International Corporation (SMIC) and Taiwan's TSMC are expanding their packaging facilities to meet growing demand. India's semiconductor industry is also rapidly growing, driven by government incentives and investments from companies like Vedanta and Foxconn. The market in North America is expected to grow significantly due to advanced technology, R&D investments, and companies like Intel, Qualcomm, and Texas Instruments. The CHIPS Act further supports this growth by boosting domestic semiconductor manufacturing.
The report “Semiconductor Packaging Market Size, Share & Trends Analysis Report By Material (Organic Substrate, Bonding Wire, Encapsulation Resins, Die Attach Material, Ceramic Packages), By Technology, By End Use, By Region, And Segment Forecasts, 2024 – 2030” is available now to Grand View Research customers and can also be purchased directly
The market has been experiencing a surge in activity, fueled by both circular economy initiatives and material innovations. This dynamic landscape has witnessed a flurry of new product launches, mergers and acquisitions, and expansions from key players. Companies are investing in research and development to develop sustainable packaging solutions that reduce waste and improve efficiency. This competitive environment is driving innovation and ensuring a continuous supply of advanced packaging technologies to meet the growing demands of various industries.
Semiconductor Packaging Market Report Highlights:
Based on material, organic substrate dominated the market in 2023 with a share of over 41.5% due to their cost-effectiveness and electrical performance. High demand from the electronics and communication industries is also fueling their growth The traditional packaging segment held the largest market share of over 52.5% in 2023 due to its use in electronics and automotive. Its cost-effectiveness and established manufacturing processes make it a popular choice Consumer electronics dominated the end use with the largest revenue market share of over 43.8% in 2023 due to high semiconductor usage in devices like smartphones. The trend toward miniaturization drives demand for advanced packaging Asia Pacific dominated the global market with a revenue share of over 53% in 2023 due to its strong electronics manufacturing base and investments in semiconductor technologies. Several Chinese firms are expanding their packaging facilities to meet the growing market demand
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Semiconductor Packaging Market Segmentation
Grand View Research has segmented the global semiconductor packaging market based on material, technology, end use, and region:
Semiconductor Packaging Material Outlook (Revenue, USD Million, 2018 – 2030)
Organic Substrate Bonding Wire Leadframes Encapsulation Resins Ceramic Package Die Attach Material Thermal Interface Materials Solder Balls OthersSemiconductor Packaging Technology Outlook (Revenue, USD Million, 2018 – 2030)
Advanced Packaging Flip Chip SIP 5D/3D Embedded Die Fan-in Wafer Level Packaging (FI-WLP) Fan-out Wafer Level Packaging (FO-WLP) Traditional PackagingSemiconductor Packaging End Use Outlook (Revenue, USD Million, 2018 – 2030)
Consumer Electronics Automotive Healthcare IT & Telecommunication Aerospace & Defence OthersSemiconductor Packaging Regional Outlook (Revenue, USD Million, 2018 – 2030)
North America U.S. Canada Mexico Europe Germany UK France Italy Spain Asia Pacific China India Japan South Korea Central & South America Brazil Argentina Middle East & Africa Israel UAE South Africa
List of Key Players in the Semiconductor Packaging Market
ASE Amkor Technology JCET Group Siliconware Precision Industries Co. Ltd. Powertech Technology Inc. Tianshui Huatian Technology Co. Ltd Fujitsu Semiconductor Ltd UTAC ChipMOS TECHNOLOGIES INC. CHIPBOND Technology Corporation Intel Corporation Samsung Unisem (M) Berhad Camtek LG Chem
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